Aurora
 

Thin Film circuit

 

一、Features

 Depositing integrated component on substrate, such as film capacitor, film inductor, film resistor and distributed circuit components.
Wide range and high precision of component parameters.
 Excellent temperature and frequency characteristic, effective work at millimeter wave band.
 High integrity and small size.

二、Substrates & Specifications

Properties

Unit

As-fired Al2O3

Polished Al2O3

BeO

AlN

Purity

%

99.6

99.6

99.5

98

Surface Finish

Ra(um)

0.10~0.20

0.10~0.05

0.10~0.20

0.10~0.20

Density

g/cm3

3.87

3.87

2.85

3.28

Camber

inch/inch

0.002

0.002

0.003~0.005

0.003~0.005

CET

10-6

7.0-8.3
(25-1000℃)

7.0-8.3
(25-1000℃)

9.0
(25-1000℃)

4.6
(25-1000℃)

TC

W/m·K

26.9

26.9

270

170

K

@1MHz

9.9±0.1

9.9±0.1

6.5

8.6

K

@4GHz

9.9

9.9

――

――

K

@10GHz

9.7

9.7

――

――

DF

@1MHz

0.0001

0.0001

0.0004

0.001

DF

@4GHz

0.0002

0.0002

――

――

DF

@10GHz

5000

5000

――

――

三、Normal Thichness & Codes 

Code

10

15

20

25

30

40

T

0.254±0.025
0.010±0.001

0.381±0.050
0.015±0.002

0.508±0.050
0.020±0.002

0.635±0.050
0.025±0.002

0.762±0.050
0.030±0.002

1.016±0.050
0.040±0.002


Note: Other thickness are available upon request. Please contact us.

四、Via Hole Metalization

We can provide via hole metalization on Alumina substrate, and the resistance of the via hole not larger than 50 mΩ。

Specifications of Via Hole

Normal D:T

Min. D:T

Min. A

Min. B

Min. C

1:1

0.6

0.8×T×2

0.8×T×1.5

63.5um

五、Surface Metalization

We provide two kinds of metalizations: (TaN)/TiW/Ni/Au and (TaN)/TiW/Au. When there is a resistor in the circuit, TaN is necessary.

Metalization

 

Form

Thickness

Au

(>4.0um)

Au

(0.10~0.20um)

TiW

(0.08~0.12um)

TaN

(0.02~0.06um)

Imaging

Item

Parameter

Minimum Line width

0.02mm

Minimum Space width

0.02mm

Tolerance of line & space

±0.002mm

Tolerance of alignment

<0.01mm

Properties

Item

参数

Square resistance range

20~100Ω/□

Tolerance of resistance

<±10%

TCR

<±150ppm/℃

Baking

400℃×10min

Solder Method of Metalization

Metalization 

Function

Suitable solder

Non-Suitable solder

TiW/Au

Provide microstrip line

AuSn, AuGe, AuSi,
Conductive adhesive

PbSn

TaN/TiW/Au

Microstrip line resistor

AuSn, AuGe, AuSi,
Conductive adhesive

PbSn

TiW/Ni/Au

Provide microstrip line

AuSn, AuGe, AuSi, PbSn,Conductive adhesive

——

TaN/TiW/Ni/Au

Microstrip line resistor

AuSn, AuGe, AuSi, PbSn,Conductive adhesive

——

Shape & Tolerance
 

We usually provide rectangle circuit, but also provide non-rectangle circuit on request.


 

 

Size tolerance (mm)

Item

Tolerance

L

±0.05

W

±0.05

 

Size tolerance  (mm)

Item

Tolerance

L (W)

±0.05

a(b)

±0.10