Gowin Semicondur начала выпуск low density FPGA

 Gowin Semiconductor Corporation, a leading FPGA programmable solution provider in China, announced new devices in its GW1N non-volatile FPGA family today. There are total 5 FPGA devices offered in this family from previously announced two devices. They are GW1N-1, GW1N-2, GW1N-4, GW1N-6 and GW1N-9. This family of devices provide abundant resources in low density FPGA designs, including up to 9K LUTs; up to 198K embedded block SRAM bits and nearly 20K Shadow SRAM bits; up to 2 Million user flash memory bits; up to 20 dedicated 18x18 multipliers and accumulators; up to 276 user I/O. It also supports applications involved PLL and DLL.


Figure 1. GW1N-1 FPGA in TQFP144


  GW1N devices provide many types of packages such as WLCSP25, WLCSP72, QFN32, TQFP100, TQFPQ44, MBGA160, PBGA204, PBGA256, and UBGA332. This allows users easily find the best option for their designs.

GW1N family of devices are fabricated on TSMC 55nm embedded flash process, focusing on low cost, small form package applications. The on-chip user flash memory can be random accessed by user logic just as an off shelf flash memory device in the market. These devices are made with high reliability standard such as 10 years’ data retention and 10 thousand cycle’s endurance for the flash memory cells.


  The GW1N-1 engineering sample in TQFP144 package and entry level evaluation board are available now.